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SC18IS602B 数据表 (PDF) - NXP Semiconductors

SC18IS602B Datasheet PDF - NXP Semiconductors
部件名 SC18IS602B
下载  SC18IS602B 下载
文件大小   250.15 Kbytes
页   25 Pages
制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors
功能描述 I2C-bus to SPI bridge

SC18IS602B Datasheet (PDF)

Go To PDF Page 下载 数据表
SC18IS602B Datasheet PDF - NXP Semiconductors

部件名 SC18IS602B
下载  SC18IS602B Click to download

文件大小   250.15 Kbytes
页   25 Pages
制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors
功能描述 I2C-bus to SPI bridge

SC18IS602B 数据表 (HTML) - NXP Semiconductors


SC18IS602B 产品详情

General description
The SC18IS602B is designed to serve as an interface between a standard I2C-bus of a
microcontroller and an SPI bus. This allows the microcontroller to communicate directly
with SPI devices through its I2C-bus. The SC18IS602B operates as an I2C-bus
slave-transmitter or slave-receiver and an SPI master. The SC18IS602B controls all the
SPI bus-specific sequences, protocol, and timing. The SC18IS602B has its own internal
oscillator, and it supports four SPI chip select outputs that may be configured as GPIO
when not used.

Features and benefits
 I2C-bus slave interface operating up to 400 kHz
 SPI master operating up to 1.8 Mbit/s
 200-byte data buffer
 Up to four slave select outputs
 Up to four programmable I/O pins
 Operating supply voltage: 2.4 V to 3.6 V
 Low power mode
 Internal oscillator option
 Active LOW interrupt output
 ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
 Latch-up testing is done to JEDEC Standard JESD78 that exceeds 100 mA
 Very small 16-pin TSSOP




类似零件编号 - SC18IS602B

制造商部件名数据表功能描述
logo
NXP Semiconductors
SC18IS602B NXP-SC18IS602B Datasheet
140Kb / 25P
I2C-bus to SPI bridge
Rev. 04-11 March 2008
SC18IS602B NXP-SC18IS602B Datasheet
217Kb / 25P
I2C-bus to SPI bridge
Rev. 5-3 August 2010
SC18IS602BIPW NXP-SC18IS602BIPW Datasheet
140Kb / 25P
I2C-bus to SPI bridge
Rev. 04-11 March 2008
SC18IS602BIPW NXP-SC18IS602BIPW Datasheet
217Kb / 25P
I2C-bus to SPI bridge
Rev. 5-3 August 2010
SC18IS602B_1008 NXP-SC18IS602B_1008 Datasheet
217Kb / 25P
I2C-bus to SPI bridge
Rev. 5-3 August 2010
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类似说明 - SC18IS602B

制造商部件名数据表功能描述
logo
NXP Semiconductors
SC18IS600 NXP-SC18IS600 Datasheet
173Kb / 30P
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Rev. 05-28 July 2008
SC18IS602 NXP-SC18IS602 Datasheet
140Kb / 25P
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SC18IS602B_1008 NXP-SC18IS602B_1008 Datasheet
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PCA9564 PHILIPS-PCA9564_06 Datasheet
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2006 Sep 01
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Maxim Integrated Produc...
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NXP Semiconductors
SC18IM704 NXP-SC18IM704 Datasheet
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Diodes Incorporated
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关于 NXP Semiconductors


NXP半导体是一家公开交易的跨国公司,设计,开发和制造各种半导体和集成电路,用于各种应用,包括汽车,工业,通信和消费市场。

该公司成立于2006年,总部位于荷兰的埃因霍温。

NXP提供了广泛的产品组合,包括微控制器,微处理器,安全身份验证IC,电源管理ICS,RF和微波炉组件以及传感器解决方案等。

该公司的产品旨在具有节能,安全和可靠,并用于各种应用中,包括汽车系统,工业自动化和控制,智能家居和建筑物以及连接的设备。

NXP致力于创新和客户满意度,并致力于为客户提供最佳的半导体解决方案,以满足他们的需求。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。




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