Technical Data
Rated Voltage up to 60 VDC
Breaking Capacity up to 400 A
Mounting PCB,SMT
Tripping temperature >175°C or >210°C
Material: Housing Plastics
Material: Terminals Copper alloy, tin-plated
Unit Weight 0.75 g
Storage Conditions 0 °C to 40 °C, max. 70% r.h.
Product Marking Variant Code, Lot no.
Activation force Fa = max. 50 N
Activation distance Sa = 1.1 +0.3/-0.1 mm
Maximum reflow temperature 260 °C (peak)
Soldering Methods Reflow
Soldering Profile
Solderability JESD22-B102E, Method 1
Resistance to Soldering Heat JEDEC J-STD-020
Moisture Sensitivity Level MSL 1, J-STD-020
Damp heat, steady state MIL-STD-202, Method 103
Thermal Shock MIL-STD-202, Method 107
Operational Life MIL-STD-202, Method 108 Condition D
Vibration, High Frequency MIL-STD-202, Method 204 Condition D
Mechanical Shock MIL-STD-202, Method 213 Condition B
Resistance to Solvents MIL-STD-202, Method 215
Temperature Cycling JESD22, Method JA-104 Condition G
Flame Retardance AEC-Q200-001 + SAG Specification
Board Flex AEC-Q200-005
Terminal Strength AEC-Q200-006