Features
 17.7 – 21.2GHz operation
 Supports 4 dual-pol or 8 single-pol elements
 Two simultaneous and independent beam outputs
 Integrated Hi-Q transmit reject filter
 28dB typical channel gain
 26dB gain control with 0.45dB step size
 360° phase control with 6-bit resolution
 2.3V and 1V nominal supply inputs
 Standard 1.8V digital logic
 Temperature compensation
 Temperature sensor w/ digital readout
 Advanced digital modes with fast beam steering
 On-chip beam-state memory
 7.6  7.6  0.9 mm, 165-FCBGA
Typical Applications
 Phased array antennas
 Ka-Band SATCOM terminals
 Aerospace, maritime, and SOTM

Description
The F6212 is a 16-channel dual-beam receive active beamforming
RFIC multi-chip module designed for application in Ka-Band
SATCOM planar phased array antennas. The IC has eight RF input
ports, two RF output ports, and 16 (8 per beam) phase/amplitude
control channels. The eight input ports of the IC can be driven by
eight single-polarized elements or four dual-polarized elements of
an electronically scanned array (ESA). Each channel has 6 bits of
digital phase and gain control resolution spanning 360° and 26dB
of dynamic range, enabling precise beam pattern and polarization
control.
The IC operates from two supply rails of 2.1 - 2.5V and 0.95 - 1.05V
with a typical channel gain of 28dB. The chip includes power
management features such as a low-power standby mode,
independent enable controls on every channel, and a single-beam
mode activated via a dedicated control pin. An integrated Hi-Q
bandpass filter provides rejection of SATCOM Tx and 5G mmWave
signals, improving the dynamic range without additional power
consumption. The device SPI bus and control pins operate from
standard 1.8V logic at speeds up to 50MHz. Advanced digital
modes and large on-chip memory allow for < 100ns beam position
switching times at the array level, greatly reducing dead time and
latency.
Finally, the compact and CTE-matched FCBGA organic package
with all single-ended 50ohm matched RF ports and 0.5mm pitch
greatly simplifies the physical integration of these devices onto
large antenna panels.