Features
 Maximum target input capacitance: 260pF
 Sampling rates as fast as 0.7ms at 8-bit resolution; 1.6ms at
10-bit; 5.0ms at 12-bit; 18.5ms at 14-bit
 Digital compensation of sensor: piece-wise 1st and 2nd order
sensor compensation or up to 3rd order single-region sensor
compensation
 Digital compensation of 1st and 2nd order temperature gain
and offset drift
 Internal temperature compensation reference (no external
components)
 Programmable capacitance span and offset
 Layout customized for die-die bonding with sensor for lowcost,
high-density chip-on-board assembly
 Accuracy as high as ±0.25% FSO at -40°C to 125°C, 3V, 5V,
Vsupply ±10% (see data sheet section 5 for restrictions)
 Minimized calibration costs: no laser trimming, one-pass
calibration using a digital interface
 Wide capacitance range to support a broad portfolio of
different sensor elements
 Excellent for low-power battery applications
 I2C or SPI interface—easy connection to a microcontroller
 PDM outputs (Filtered Analog Ratiometric) for both
capacitance and temperature
 Up to two alarms that can act as full push-pull or open-drain
switches
 Supply voltage: 2.3V to 5.5V
 Typical current consumption 750μA down to 60μA depending
on configuration
 Typical Sleep Mode current: ≤ 1μA at 85°C
 Operation temperature: –40°C to +125°C depending on part
code
 Die or 4.4  5.0 mm 14-TSSOP package