Features
▪ 32-Mbit Flash Memory
▪ Serial Peripheral Interface (SPI) Compatible
• Supports SPI modes 0 and 3
• Supports single input/output operations (1,1,1)
• Supports dual input and dual output operations (1-1-2), (1-2-2), (0-2-2)
• Supports quad input and quad output operations (1-1-4), (1-4-4), (0-4-4)
▪ Continuous Read mode (with 8/16/32/64 bytes wrap) - optimized for XiP
▪ 108 MHz Maximum Operating Frequency
▪ Single 2.7 V - 3.6 V Single Supply Voltage
▪ Serial Flash Discoverable Parameters (SFDP, JESD216B) support
▪ OTP Memory
• Three Protected Programmable Security Register Pages (Page size: 256 bytes)
• 64-bit factory programmable UID register
▪ Hardware Write Protection (WP pin)
▪ Software Write protection (Programmable non-volatile control registers)
▪ Program and Erase Suspend and Resume
▪ Byte programming size: up to 256 bytes
▪ Erase Size and Duration
• Uniform 4-kbyte Block Erase (55 ms typical)
• Uniform 32-kbyte Block Erase (120 ms typical)
• Uniform 64-kbyte Block Erase (200 ms typical)
• Full Chip Erase (10 seconds typical)
▪ Low Power Dissipation
• Standby Current (13 µA typical)
• Deep Power Down Current (1 µA typical)
▪ Endurance: 100,000 Program and Erase Cycles
▪ Data Retention: 20 Years
▪ Industrial Temperature Range (-40 oC to 85 oC)
▪ Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options
• 8-lead SOIC (0.150” Narrow and 0.208” Wide)
• 8-pad Ultra-Thin DFN (5 x 6 x 0.6 mm)
• Die Wafer Form
• Other Package Options (contact Renesas Electronics)