Key Features
■ Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47 Part 15 (US) and ARIB STD-T66 (Japan)
■ Supports up to three BLE connections
■ Typical cold boot to radio active 35 ms
■ Processing power
□ 16 MHz 32-bit Arm® Cortex-M0+ with SWD interface
□ 18300 EEMBC IoTMark-BLE® score
□ Dedicated Link Layer and AES-128 Encryption Processor
□ Software-based True Random Number Generator (TRNG)
■ Memories
□ 32 kB One-Time-Programmable (OTP)
□ 48 kB Retainable System RAM
□ 144 kB ROM
■ Power management
□ Integrated core LDO with sleep mode
□ Clock-less hibernation mode 300 nA
□ Built-in temperature sensor for die temperature monitoring