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MPC106ARX66CG 数据表 (PDF) - NXP Semiconductors

MPC106ARX66CG Datasheet PDF - NXP Semiconductors
部件名 MPC106ARX66CG
下载  MPC106ARX66CG 下载
文件大小   443.98 Kbytes
页   28 Pages
制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors
功能描述 MPC106 PCI Bridge/Memory Controller Hardware Specifications

MPC106ARX66CG Datasheet (PDF)

Go To PDF Page 下载 数据表
MPC106ARX66CG Datasheet PDF - NXP Semiconductors

部件名 MPC106ARX66CG
下载  MPC106ARX66CG Click to download

文件大小   443.98 Kbytes
页   28 Pages
制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors
功能描述 MPC106 PCI Bridge/Memory Controller Hardware Specifications

MPC106ARX66CG 数据表 (HTML) - NXP Semiconductors


MPC106ARX66CG 产品详情

Features
This section summarizes the major features of the 106, as follows:
• 60x processor interface
— Supports up to four 60x processors
— Supports various operating frequencies and bus divider ratios
— 32-bit address bus, 64-bit data bus
— Supports full memory coherency
— Supports optional 60x local bus slave
— Decoupled address and data buses for pipelining of 60x accesses
— Store gathering on 60x-to-PCI writes
• Secondary (L2) cache control
— Configurable for write-through or write-back operation
— Supports cache sizes of 256 Kbytes, 512 Kbytes, and 1 Mbyte
— Up to 4 Gbytes of cacheable space
— Direct-mapped
— Supports byte parity
— Supports partial update with external byte decode for write enables
— Programmable interface timing
— Supports pipelined burst, synchronous burst, or asynchronous SRAMs
— Alternately supports an external L2 cache controller or integrated L2 cache module
• Memory interface
— 1 Gbyte of RAM space, 16 Mbytes of ROM space
— Supports parity or error checking and correction (ECC)
— High-bandwidth, 64-bit data bus (72 bits including parity or ECC)
— Supports fast page mode DRAMs, extended data out (EDO) DRAMs, and synchronous
DRAMs (SDRAMs)
— Supports 1 to 8 banks of DRAM/EDO/SDRAM with sizes ranging from 2 Mbyte to
128 Mbytes per bank
— ROM space may be split between the PCI bus and the 60x/memory bus (8 Mbytes each)
— Supports 8-bit asynchronous ROM or 64-bit burst-mode ROM
— Supports writing to Flash ROM
— Configurable external buffer control logic
— Programmable interface timing
• PCI interface
— Compliant with
PCI Local Bus Specification,
Revision 2.1
— Supports PCI interlocked accesses to memory using LOCK signal and protocol
— Supports accesses to all PCI address spaces
— Selectable big- or little-endian operation
— Store gathering on PCI writes to memory
— Selectable memory prefetching of PCI read accesses
— Only one external load presented by the MPC106 to the PCI bus
— Interface operates at 20–33 MHz
— Word parity supported
— 3.3 V/5.0 V-compatible
• Support for concurrent transactions on 60x and PCI buses
• Power management
— Fully-static 3.3-V CMOS design
— Supports 60x nap, doze, and sleep power management modes and suspend mode
• IEEE 1149.1-compliant, JTAG boundary-scan interface
• 304-pin ceramic ball grid array (CBGA) package




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关于 NXP Semiconductors


NXP半导体是一家公开交易的跨国公司,设计,开发和制造各种半导体和集成电路,用于各种应用,包括汽车,工业,通信和消费市场。

该公司成立于2006年,总部位于荷兰的埃因霍温。

NXP提供了广泛的产品组合,包括微控制器,微处理器,安全身份验证IC,电源管理ICS,RF和微波炉组件以及传感器解决方案等。

该公司的产品旨在具有节能,安全和可靠,并用于各种应用中,包括汽车系统,工业自动化和控制,智能家居和建筑物以及连接的设备。

NXP致力于创新和客户满意度,并致力于为客户提供最佳的半导体解决方案,以满足他们的需求。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。




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