| 制造商 | 部件名 | 数据表 | 功能描述 |
 National Semiconductor ... |
MS48A
|
35Kb / 1P |
MOLDED PACKAGE SSOP,. 300 WIDE 48 LEAD
|
|
D24K
|
57Kb / 1P |
24 Lead (0.400횞 Wide) Ceramic Sidebrazed Dual-in-Line Package NS Package Number D24K
|
 NXP Semiconductors |
SOT117-1
|
9Kb / 1P |
DIP28: plastic dual in-line package; 28 leads (600 mil)
2003 Feb 18 |
 National Semiconductor ... |
N40A
|
60Kb / 1P |
40 Lead (0.600 횞 Wide) Molded Dual-in-Line Package
|
|
J22A
|
67Kb / 1P |
22 Lead Ceramic Dual-in-Line Package
|
 Wall Industries,Inc. |
LANCW3
|
105Kb / 3P |
Wide Input Range, Dual In-Line Package
|
 HuaXinAn Electronics CO... |
DIR-1A
|
435Kb / 4P |
Epoxy molded Dual-In-Line package.
|
|
DIR-1B
|
435Kb / 4P |
Epoxy molded Dual-In-Line package
|
 Linear Technology |
LT6301
|
252Kb / 16P |
Dual 500mA, Differential xDSL Line Driver in 28-Lead TSSOP Package
|
|
LT6301
|
225Kb / 16P |
Dual 500mA, Differential xDSL Line Driver in 28-Lead TSSOP Package
|