1 Features
• AEC-Q100 qualified with:
– Temperature grade 0: –40°C to 150°C Ambient
Operating Temperature Range
– Device HBM ESD classification level 2
– Device CDM ESD classification level C5
• Robust integrated isolation barrier:
– Withstand isolation voltage: 3000 VRMS
– Isolation working voltage: 500 VRMS
• Isolation barrier life: > 50 years
• Temperature sensor accuracy
– ±0.5°C typical at 25°C
– ±1.5°C maximum from 0°C to 70°C
– ±2.0°C maximum from –40°C to +150°C
• Operating supply range: 2.3 V to 5.5 V
• Positive slope sensor gain: 10 mV/°C, with 500 mV
offset at 0°C
• Fast thermal response: < 2 seconds
• Short circuit protected output
• Low power consumption: 9 μA (typical)
• DFQ (SOIC-7) package
• Safety-related certifications (planned):
– 3-kVRMS isolation for 1 minute per UL 1577

2 Applications
• Silicon Carbide (SiC) PowerFET temperature
monitoring
• Insulated-Gate Bipolar Transistor (IGBT)
PowerFET temperature monitoring
• HEV/EV battery-management system (BMS)
• HEV/EV on-board charger (OBC) & wireless
charger
• HEV/EV DC/DC converter
• HEV/EV inverter & motor control
• Powertrain temperature sensor

3 Description
The ISOTMP35-Q1 is the industry’s first isolated
temperature sensor IC, combining an integrated
isolation barrier, up to 3000 VRMS withstand voltage,
with an analog temperature sensor featuring a 10
mV/°C slope from –40°C to +150°C. This integration
enables the sensor to be co-located with high voltage
heat source (for example: HV FETs, IGBTs, or
HV contactors) without requiring expensive isolation
circuitry. The direct contact with the high-voltage heat
source also provides greater accuracy and faster
thermal response compared approaches where the
sensor is placed further away to meet isolation
requirements.
Operating from a non-isolated 2.3-V to 5.5-V
supply, the ISOTMP35-Q1 allows easy integration
into applications where sub-regulated power is not
available on the high-voltage plane.
The integrated isolation barrier satisfies UL 1577
requirements. The surface mount package (7-pin
SOIC) provides excellent heat flow from the heat
source to the embedded thermal sensor, minimizing
thermal mass and providing more accurate heatsource
measurement. This reduces the need for timeconsuming
thermal modeling and improves system
design margin by reducing mechanical variations due
to manufacturing and assembly.
The ISOTMP35-Q1 class-AB output driver provides
a strong 500-μA maximum output to drive capacitive
loads up to 1000 pF and is designed to directly
interface with analog-to-digital converter (ADC)
sample and hold inputs.