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CC2340R5 数据表 (PDF) - Texas Instruments

CC2340R5 Datasheet PDF - Texas Instruments
部件名 CC2340R5
下载  CC2340R5 下载
文件大小   2217.66 Kbytes
  63 Pages
制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments
功能描述 CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

CC2340R5 Datasheet (PDF)

Go To PDF Page 下载 数据表
CC2340R5 Datasheet PDF - Texas Instruments

部件名 CC2340R5
下载  CC2340R5 Click to download

文件大小   2217.66 Kbytes
  63 Pages
制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments
功能描述 CC2340R5-Q1 SimpleLink™ Bluetooth ® 5.3 Low Energy Wireless MCU

CC2340R5 数据表 (HTML) - Texas Instruments


CC2340R5 产品详情

1 Features
Wireless microcontroller
• AEC-Q100 Grade 2 qualified for Automotive
applications
• Optimized 48-MHz Arm® Cortex®-M0+ processor
• 512 KB of in-system programmable flash
• 12 KB of ROM for bootloader and drivers
• 36 KB of ultra-low leakage SRAM. Full RAM
retention in standby mode
• 2.4 GHz RF transceiver compatible with
Bluetooth® 5.3 Low Energy
• Integrated balun
• Supports over-the-air upgrade (OTA)
• Serial Wire Debug (SWD)
Low power consumption
• MCU consumption:
– 2.6 mA active mode, CoreMark®
– 53 μA/MHz running CoreMark®
– < 710 nA standby mode, RTC, 36 KB RAM
– 165 nA shutdown mode, wake-up on pin
• Radio Consumption:
– 5.3 mA RX
– 5.1 mA TX at 0 dBm
– < 11.0 mA TX at +8 dBm
Wireless protocol support
• Bluetooth® 5.3 Low Energy
High-performance radio
• -102 dBm for Bluetooth® Low Energy 125 kbps
• -96.5 dBm for Bluetooth® Low Energy 1 Mbps
• Output power up to +8 dBm with temperature
compensation
Regulatory compliance
• Suitable for systems targeting compliance with
these standards:
– EN 300 328 (Europe)
– FCC CFR47 Part 15
– ARIB STD-T66 (Japan)
MCU peripherals
• 19 I/O Pads
– 2 IO pads SWD, muxed with GPIOs
– 2 IO pads LFXT, muxed with GPIOs
– 15 DIOs (analog or digital IOs)
• 3 × 16-bit and 1× 24-bit general-purpose timers,
quadrature decode mode support
• 12-bit ADC, 1.2 Msps with external reference, 267
ksps with internal reference, 8 external ADC inputs
• 1× low power comparator
• 1× UART
• 1× SPI
• 1× I2C
• Real-time clock (RTC)
• Integrated temperature and battery monitor
• Watchdog timer
Security enablers
• AES 128-bit cryptographic accelerator
• Random number generator from on-chip analog
noise
Development tools and software
• LP-EM-CC2340R5 LaunchPad Development Kit
• SimpleLink™ CC23xx Software Development Kit
(SDK)
• SmartRF™ Studio for simple radio configuration
• SysConfig system configuration tool
Operating range
• On-chip buck DC/DC converter
• 1.71-V to 3.8-V single supply voltage
• Tj: -40 to +125°C
• HBM ESD Classification Level 2
• CDM ESD Classification Level C3
RoHS-compliant package
• 5-mm × 5-mm RHB QFN32 with wettable flanks
(19 GPIOs)

2 Applications
• Automotive
– Car access and security systems
• Passive entry passive start (PEPS)
• Remote keyless entry (RKE)
– Advanced driver assistance systems (ADAS)
– Tire pressure monitoring systems (TPMS)

3 Description
The SimpleLink™ CC2340R5-Q1 device is an AEC-Q100 compliant wireless microcontroller (MCU) targeting
Bluetooth 5 Low Energy automotive applications. The device is optimized for low-power wireless communication
in applications such as tire pressure monitoring systems (TPMS), car access including key fogs used in passive
entry passive start (PEPS) and remote keyless entry (RKE), cable replacement, and smartphone connectivity.
The Highlighted features of this device include:
• Support for Bluetooth ® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and
500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and
support for key features from the Bluetooth ® 4.2 and earlier Low Energy specifications.
• Fully-qualified Bluetooth ® 5.3 software protocol stack included with the SimpleLink™ CC23xx Software
Development Kit (SDK).
• Ultra-low standby current less than 0.71 μA with RTC operational and full RAM retention that enables
significant battery life extension especially for applications with longer sleep intervals.
• Integrated balun for reduced Bill-of-Material (BOM) board layout.
• Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth ® Low Energy
(-102 dBm for 125 kbps LE Coded PHY, with integrated balun).
The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi®, Bluetooth Low
Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development
environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the
SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing
100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU
platform.




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关于 Texas Instruments


Texas Instruments(TI)是一家公开交易的公司,设计和制造半导体和计算机技术产品。

它成立于1930年,总部位于德克萨斯州达拉斯。

Ti是模拟和数字信号处理(DSP)集成电路以及嵌入式处理器和其他微控制器产品的全球领导者。

该公司为各种行业的客户提供服务,包括汽车,通信,计算,工业和消费电子产品。

Ti的产品组合包括数据转换器,放大器和比较器,电源管理IC,微控制器,传感器和无线连接解决方​​案等。

TI致力于创新和客户满意度,并拥有为客户提供高质量可靠的产品的悠久历史。

侧重于可持续性和能源效率,TI致力于通过其技术和产品对世界产生积极影响。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。




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