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231-69PAB 数据表 (PDF) - List of Unclassifed Manufacturers

231-69PAB Datasheet PDF - List of Unclassifed Manufacturers
部件名 231-69PAB
下载  231-69PAB 下载
文件大小   8044.67 Kbytes
  21 Pages
制造商  ETC [List of Unclassifed Manufacturers]
网页  
标志 ETC - List of Unclassifed Manufacturers
功能描述 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

231-69PAB Datasheet (PDF)

Go To PDF Page 下载 数据表
231-69PAB Datasheet PDF - List of Unclassifed Manufacturers

部件名 231-69PAB
下载  231-69PAB Click to download

文件大小   8044.67 Kbytes
  21 Pages
制造商  ETC [List of Unclassifed Manufacturers]
网页  
标志 ETC - List of Unclassifed Manufacturers
功能描述 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

231-69PAB 数据表 (HTML) - List of Unclassifed Manufacturers


231-69PAB 产品详情

• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
FEATURES AND BENEFITS




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