Description
The SOP-8 has been modified through a customized leadframe for enhanced
thermal characteristics and multiple-die capability making it ideal in a
variety of power applications. With these improvements,multiple devices
can be used in an application with dramatically reduced board space.The
package is designed for vapor phase, infra red,or wave
soldering techniques.Power dissipation of greater than 0.8W is possible in
a typical PCB mount application.

Generation V Technology
Ultra Low On-Resistance
Dual N-Channel Mosfet
Surface Mount
Available in Tape &Reel
Dynamic dv/dt Rating
Fast Switching
Lead-Free

Features
VDS (V) = 20V
RDS(ON) < 40mΩ (VGS = 4.5V)
RDS(ON) < 50mΩ (VGS = 2.7V)