PDIP 数据表(PDF) - Amkor Technology

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PDIP 数据表 (PDF) - Amkor Technology

PDIP Datasheet PDF - Amkor Technology


部件名	PDIP

下载	PDIP 下载

文件大小	393.79 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Amkor?셲 PDIP packages offer

PDIP Datasheet (PDF)

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下载数据表

PDIP Datasheet PDF - Amkor Technology


部件名	PDIP

下载	PDIP Click to download

文件大小	393.79 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Amkor?셲 PDIP packages offer

PDIP 数据表 (HTML) - Amkor Technology

PDIP Datasheet HTML 1Page - Amkor Technology

PDIP Datasheet HTML 2Page - Amkor Technology

类似零件编号 - PDIP

制造商	部件名	数据表	功能描述
Amkor Technology	PDIP	411Kb / 2P	Silver Wirebonding 02/22
Analog Microelectronics	PDIP-40	53Kb / 1P	A : MIN 3.300 MAX 4.200 B : MIN 0.018 MAX 0.570
Analog Microelectronics	PDIP-8	53Kb / 1P	A : MIN 0.13 MAX - B : MIN 6.10 MAX 7.10
Banner Engineering Corp...	PDIP1100T5X	15Mb / 42P	Fiber Optic Systems
Banner Engineering Corp...	PDIP1100TMB5X	15Mb / 42P	Fiber Optic Systems

类似说明 - PDIP

制造商	部件名	数据表	功能描述
Cypress Semiconductor	CYM1465A	170Kb / 7P	512K x 8 PDIP Static RAM
Amkor Technology	MQFP	389Kb / 2P	Amkor?셲 MQFP IC package portfolio provides
Amkor Technology	PLCC	387Kb / 2P	Amkor?셲 PLCC IC package portfolio provides
Estek Electronics Co. L...	24C02	1Mb / 13P	8-lead PDIP, 8-lead SOP and 8-lead TSSOP Packages
Estek Electronics Co. L...	24C64	1Mb / 12P	available in space-saving 8-lead PDIP, 8-lead SOP, and 8-lead TSSOP packages
Maxim Integrated Produc...	21-0043	43Kb / 1P	PACKAGE OUTLINE, PDIP.300 Rev E
COSMO Electronics Corp...	KLE06WXX4	99Kb / 6P	Cosmo?셲 high power LED packages can handle up to 350-500mA DC current
List of Unclassifed Man...	694-3-R100KD	144Kb / 3P	Isolated, bussed and other circuits Thin film resistor network 0.300??PDIP packages
COSMO Electronics Corp...	KLE06WXX3	90Kb / 6P	Cosmo?셲 high power LED packages
COSMO Electronics Corp...	KLE00WXX1	119Kb / 6P	Cosmo?셲 high power LED packages

关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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