POWERSOP2 数据表(PDF) - Amkor Technology

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POWERSOP2 数据表 (PDF) - Amkor Technology

POWERSOP2 Datasheet PDF - Amkor Technology


部件名	POWERSOP2

下载	POWERSOP2 下载

文件大小	367.33 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Exceptional performance through the innovative design of PSOPs offer

POWERSOP2 Datasheet (PDF)

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下载数据表

POWERSOP2 Datasheet PDF - Amkor Technology


部件名	POWERSOP2

下载	POWERSOP2 Click to download

文件大小	367.33 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Exceptional performance through the innovative design of PSOPs offer

POWERSOP2 数据表 (HTML) - Amkor Technology

POWERSOP2 Datasheet HTML 1Page - Amkor Technology

POWERSOP2 Datasheet HTML 2Page - Amkor Technology

类似零件编号 - POWERSOP2

制造商	部件名	数据表	功能描述
Amkor Technology	POWERSOP	311Kb / 2P	Power Small Outline Package,PowerSOP

类似说明 - POWERSOP2

制造商	部件名	数据表	功能描述
Amkor Technology	MQFPPOWERQUAD2	99Kb / 2P	Exceptional thermal and electrical performance by design include the following
National Semiconductor ...	AN-2026	450Kb / 8P	The Effect of PCB Design on the Thermal Performance of SIMPLE SWITCHER
STMicroelectronics	UM1755	1Mb / 123P	The purpose of this document is to describe the design of the application 17-Nov-2014
STMicroelectronics	UM1865	1Mb / 132P	The purpose of this document is to describe the design of the application 04-Mar-2015
M/A-COM Technology Solu...	MASW-000932	618Kb / 7P	Exceptional Broadband Performance
SYNERGY MICROWAVE CORPO...	DCRO119185-12-1	345Kb / 3P	Exceptional Phase Noise Performance
	DCRO221226-8	350Kb / 3P	Exceptional Phase Noise Performance
	DCSR4143-8	372Kb / 3P	Exceptional Phase Noise Performance
M/A-COM Technology Solu...	MASW-000932	618Kb / 7P	Exceptional Broadband Performance
Cherry Semiconductor Co...	SR-4300	134Kb / 2P	ExpressCards Offer Even More Speed and Performance than the PC Card

关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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