MEMS 数据表(PDF) - Amkor Technology

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MEMS 数据表 (PDF) - Amkor Technology

MEMS Datasheet PDF - Amkor Technology


部件名	MEMS

下载	MEMS 下载

文件大小	1019.84 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	MEMS are micron-size devices that can sense or manipulate the physical world.

MEMS Datasheet (PDF)

Go To PDF Page

下载数据表

MEMS Datasheet PDF - Amkor Technology


部件名	MEMS

下载	MEMS Click to download

文件大小	1019.84 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	MEMS are micron-size devices that can sense or manipulate the physical world.

MEMS 数据表 (HTML) - Amkor Technology

MEMS Datasheet HTML 1Page - Amkor Technology

MEMS Datasheet HTML 2Page - Amkor Technology

MEMS 产品详情

MEMS Applications
Amkor Technology is the world’s leader in microelectronic packaging technologies and the world’s largest outsource provider of MEMS and Micro Optical Electronic Mechanical Systems (MOEMS).

类似零件编号 - MEMS

制造商	部件名	数据表	功能描述
STMicroelectronics	MEMS	1Mb / 2P	analog and digital Dec-2014

类似说明 - MEMS

制造商	部件名	数据表	功能描述
CML Microcircuits	FX202	144Kb / 3P	SMALL PHYSICAL SIZE
List of Unclassifed Man...	EFM32WG232	3Mb / 72P	The EFM32 MCUs are the world?셲 most energy friendly microcontrollers.
	EFM32WG280	3Mb / 76P	The EFM32 MCUs are the world?셲 most energy friendly microcontrollers.
	EFM32WG395	3Mb / 77P	The EFM32 MCUs are the world?셲 most energy friendly microcontrollers.
	EFM32WG980	3Mb / 80P	The EFM32 MCUs are the world?셲 most energy friendly microcontrollers.
	EFM32WG990	3Mb / 80P	The EFM32 MCUs are the world?셲 most energy friendly microcontrollers.
Silicon Laboratories	EFM32JG1	952Kb / 94P	The EFM32 Jade Gecko MCUs are the world?셲 most energyfriendly microcontrollers
Infineon Technologies A...	XMC1300AB-STEP	2Mb / 78P	physical characteristics of the XMC1300 series devices V2.0 2017-10
Analog Devices	LT3960	1Mb / 22P	I2C to CAN-Physical Transceiver 02/21-REV.A
Analog Devices	LT3960	1Mb / 22P	I2C to CAN-Physical Transceiver Rev. B

关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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