Features
Innovative designs and expanding package offerings provide a platform from prototype-to-production.
Custom ball counts up to 1521
1.00, 1.27 & 1.50 mm standard ball pitch available (other ball pitches available upon request, e.g. 0.8 mm)
17 to 40 mm body sizes
Thin Au wire or Cu wire compatible
Chip-on-Chip (CoC)
Large mold cap for quality enhancement
Low profile and lightweight
Thermal and electrical enhancement capable
Highly flexible internal routing of signal, power and ground for device performance and system compatibility
HDI designs possible
Suitable substrate for multi-die (MCM) and integrated SMT structures
Mature strip based manufacturing process with high yields
Full in-house design capability
Quickest design-to-prototype delivery
Perimeter, stagger and full ball arrays
Special packaging for memory available
Multi-layer, ground/power
JEDEC MS-034 standard outlines
Excellent reliability
63 Sn/37 Pb eutectic or Pb-free solder balls

Applications
The integrated design features of Amkor’s PBGAs offer enhanced performance in many devices, making this the ideal package for: microprocessors, microcontrollers, ASICs, gate arrays, memory, DSPs, PLDs, graphics and PC chip sets.
Applications requiring improved portability, form-factor/size and high-performance such as cellular, wireless telecommunications, PCMCIA cards, Global Positioning Systems (GPS), laptop PCs, netbooks, video cameras, disc drives and similar products benefit from Amkor’s PBGA attributes.