SOIC 数据表(PDF) - Amkor Technology

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SOIC 数据表 (PDF) - Amkor Technology

SOIC Datasheet PDF - Amkor Technology


部件名	SOIC

下载	SOIC 下载

文件大小	505.84 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package

SOIC Datasheet (PDF)

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下载数据表

SOIC Datasheet PDF - Amkor Technology


部件名	SOIC

下载	SOIC Click to download

文件大小	505.84 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package

SOIC 数据表 (HTML) - Amkor Technology

SOIC Datasheet HTML 1Page - Amkor Technology

SOIC Datasheet HTML 2Page - Amkor Technology

SOIC 产品详情

FEATURES
Cu wire interconnect for low cost
Standard JEDEC package outlines
Multi-die production capability
Turnkey test services, including strip test options
Green materials are standard – Pb-free and RoHS compliant
Stealth dicing (narrow saw streets)
Larger/Higher density leadframe strips
Leadframe roughening for improved MSL capability

类似零件编号 - SOIC

制造商	部件名	数据表	功能描述
Welwyn Components Limit...	SOIC	429Kb / 3P	Surface Mount SOIC Resistor Networks
TT Electronics.	SOIC	496Kb / 4P	Both narrow and wide body versions available
Amkor Technology	SOIC	780Kb / 3P	ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based 12/21
Amkor Technology	SOIC	411Kb / 2P	Silver Wirebonding 02/22
International Rectifier	SOIC-14PIN	18Kb / 1P	14-Pin Surface Mount, Narrow Body

类似说明 - SOIC

制造商	部件名	数据表	功能描述
SMSC Corporation	8SOIC	295Kb / 1P	8 PIN SOIC PACKAGE OUTLINE
Maxim Integrated Produc...	21-0042	46Kb / 1P	PACKAGE OUTLINE, SOIC,300 Rev F
ACCUTEK MICROCIRCUIT CO...	AK08D300-NSO	741Kb / 11P	Small Outline Package SOIC, SOJ and PLCC DIP Adapters
Advanced Power Electron...	AP2301EN-HF	102Kb / 4P	Small Package Outline
	AP2301N-HF	65Kb / 4P	Small Package Outline
	AP2302GN-HF	102Kb / 4P	Small package outline
	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
	AP2318AGEN-HF	64Kb / 4P	Small Outline Package
	AP2323AGN-HF	104Kb / 4P	Small Package Outline
	AP2307GN-HF	65Kb / 5P	Small Package Outline

关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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