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TO-220FP 数据表 (PDF) - Amkor Technology

TO-220FP Datasheet PDF - Amkor Technology
部件名 TO-220FP
下载  TO-220FP 下载
文件大小   821.99 Kbytes
  2 Pages
制造商  AMKOR [Amkor Technology]
网页  http://www.amkor.com
标志 AMKOR - Amkor Technology
功能描述 TO-220FP is a full pack version of TO-220

TO-220FP Datasheet (PDF)

Go To PDF Page 下载 数据表
TO-220FP Datasheet PDF - Amkor Technology

部件名 TO-220FP
下载  TO-220FP Click to download

文件大小   821.99 Kbytes
  2 Pages
制造商  AMKOR [Amkor Technology]
网页  http://www.amkor.com
标志 AMKOR - Amkor Technology
功能描述 TO-220FP is a full pack version of TO-220

TO-220FP 数据表 (HTML) - Amkor Technology


TO-220FP 产品详情

FEATURES
Cu clip interconnect for better heat dissipation efficiency
Mounted package height reduced by 2.8 mm vs. standard TO-220NIS
Turnkey with test and packing services
Green materials: Pb-free plating & halogen-free mold compound

Applications
TO-220FP is suitable for medium to high-voltage MOSFETs and IGBTs used for:
Switching power supplies
AC adapters
Motor drivers
Flat panel display




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关于 Amkor Technology


Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。




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