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SMBV2527-201 数据表 (PDF) - Innogration Technologies, Inc.

SMBV2527-201 Datasheet PDF - Innogration Technologies, Inc.
部件名 SMBV2527-201
下载  SMBV2527-201 下载
文件大小   1269.74 Kbytes
页   5 Pages
制造商  INNOGRATION [Innogration Technologies, Inc.]
网页  http://www.innogration.net/index.htm
标志 INNOGRATION - Innogration Technologies, Inc.
功能描述 2.5-2.7GHz, 200W, 50V GaN matched PA Module

SMBV2527-201 Datasheet (PDF)

Go To PDF Page 下载 数据表
SMBV2527-201 Datasheet PDF - Innogration Technologies, Inc.

部件名 SMBV2527-201
下载  SMBV2527-201 Click to download

文件大小   1269.74 Kbytes
页   5 Pages
制造商  INNOGRATION [Innogration Technologies, Inc.]
网页  http://www.innogration.net/index.htm
标志 INNOGRATION - Innogration Technologies, Inc.
功能描述 2.5-2.7GHz, 200W, 50V GaN matched PA Module

SMBV2527-201 数据表 (HTML) - Innogration Technologies, Inc.


SMBV2527-201 产品详情

Description
The SMBV2527-201 is a 200-watt, integrated 2-stage Power Amplifier Module, designed for
5G massive MIMO applications, with frequencies from 2.5-2.7GHz. The module is 50 Ω
input fully matched and output partially matched, and requires minimal external components.
The module offers a much smaller footprint than traditional discrete component solutions,
with much less sensitivity for production, housed in 12*10mm cost effective plastic open
cavity package, and heat dissipated by copper flange.
The module incorporates advanced Doherty circuit delivering high power added efficiency
for the entire module at 28W average power according to normal 8.5 dB back off.
Innogration owns the patents for internal Doherty architecture, and related plastic open cavity.

Features and Benefits
 Adjustable drain bias to fit different power demand
 Extremely good VBW performance to enable the broadest IBW/OBW
 Industry leading RF performance for 5G MIMO AAU, for instance
 32T:640W / 200MHz
 Plastic open cavity without molding compound brings advantage compared to molded design
 Minimize the risk of high density thermal distribution in fanless system for longer life time
 Highly consistent RF performance for yield of volume production
 50 Ω Input matched, output partially matched, total effective PCB space smaller than 25*35mm
 Integrated Doherty Final and driver Stage
 12*10 mm Surface Mount Package, full copper flange underneath for grounding and heat dissipation, much more effective
than LGA PCB based design




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