Features
• Quad-channel architecture for UI, EIS, OIS, and high-g data processing
• "Smart, always-aware" experience for system power optimization
• Smart FIFO up to 4.5 KB
• Dual accelerometer channels
– Low-g channel ±2/±4/±8/±16 g full scale
– High-g channel ±32/±64/±128/±256/±320 g full scale
• ±250/±500/±1000/±2000/±4000 dps full scale
• SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data
synchronization
• Auxiliary SPI & MIPI I3C® v1.1 for OIS data output for gyroscope and
accelerometer
• OIS configurable from the auxiliary or primary interface
• EIS dedicated channel on primary interface with dedicated filtering
• Advanced pedometer, step detector, and step counter
• Significant motion detection, tilt detection
• Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double
click, high-g wake-up and high-g shock
• Programmable finite state machine for accelerometer (high-g & low-g),
gyroscope, and external sensor data processing with high rate @ 960 Hz
• Machine learning core with exportable features and filters for AI applications
• Embedded adaptive self-configuration (ASC)
• Embedded sensor fusion low-power (SFLP) algorithm
• Embedded temperature sensor
• Independent I/O supply
– I²C voltage range: 1.62 V to 3.6 V
– SPI / MIPI I3C® extended voltage range: 1.08 V to 3.6 V
• Supply current
– 6-axis configuration @ 0.67 mA in combo high-performance mode
– 9-axis configuration @ 0.80 mA in combo high-performance mode
• Compact footprint: 2.5 mm x 3 mm x 0.83 mm
• ECOPACK and RoHS compliant

Applications
• IoT and connected devices
• Asset tracking
• Smartphones and handheld devices
• Car crash detection and shock detection
• Wearables
• Motion tracking and gesture detection
• Augmented reality (AR) / virtual reality (VR) / mixed reality (MR) applications
• Indoor navigation
• EIS and OIS for camera applications
• Vibration monitoring and compensation