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LMV1015 数据表 (PDF) - Texas Instruments

LMV1015 Datasheet PDF - Texas Instruments
部件名 LMV1015
下载  LMV1015 下载
文件大小   457.77 Kbytes
页   16 Pages
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments
功能描述 LMV1015 Analog Series: Built-in Gain ICs for High Sensitivity 2-Wire Microphones

LMV1015 Datasheet (PDF)

Go To PDF Page 下载 数据表
LMV1015 Datasheet PDF - Texas Instruments

部件名 LMV1015
下载  LMV1015 Click to download

文件大小   457.77 Kbytes
页   16 Pages
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments
功能描述 LMV1015 Analog Series: Built-in Gain ICs for High Sensitivity 2-Wire Microphones

LMV1015 数据表 (HTML) - Texas Instruments


LMV1015 产品详情

1FEATURES
2• (Typical LMV1015-15, 2.2V supply, RL = 2.2 kΩ,
C = 2.2 μF, V IN = 18 mVPP, unless otherwise
specified)
• Supply Voltage: 2V - 5V
• Supply Current: <180 μA
• Signal to Noise Ratio (A-Weighted): 60 dB
• Output Voltage Noise (A-Weighted): −89 dBV
• Total Harmonic Distortion 0.09%
• Voltage Gain
– LMV1015-15: 15.6 dB
– LMV1015-25: 23.8 dB
• Temperature Range: −40°C to 85°C
• Large Dome 4-Bump DSBGA Package with
Improved Adhesion Technology.

APPLICATIONS
• Cellular Phones
• Headsets
• Mobile Communications
• Automotive Accessories
• PDAs
• Accessory Microphone Products

DESCRIPTION
The LMV1015 is an audio amplifier series for small
form factor electret microphones. This 2-wire portfolio
is designed to replace the JFET amplifier. The
LMV1015 series is ideally suited for applications
requiring high signal integrity in the presence of
ambient or RF noise, such as in cellular
communications. The LMV1015 audio amplifiers are
ensured to operate over a 2.2V to 5.0V supply
voltage range with fixed gains of 15.6 dB and 23.8
dB. The devices offer excellent THD, gain accuracy
and temperature stability as compared to a JFET
microphone.
The LMV1015 series enables a two-pin electret
microphone solution, which provides direct pin-to-pin
compatibility with the existing older JFET market.
Texas Instruments' built-in gain families are offered in extremely thin space saving 4-bump DSBGA
packages (0.3 mm maximum). The LMV1015XR is
designed for 1.0 mm ECM canisters and thicker.
These extremely miniature packages have the Large
Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs
requiring 1 kg adhesion criteria.




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