FEATURES
• Temperature coefficient of resistance (TCR)
+25°C to +60°C, +25°C ref.: 0 ±1 ppm/°C
–25°C to +125°C, +25°C ref.: 0 ±5 ppm/°C
• Utilizing Ni-Cr Bulk Metal® Foil Technology for realizing low TCR
• Low thermal resistance with Copper plate
Improved to 0.1°C/W from 0.3°C/W (conventional model)
Maximum rated power up to 500W on heat sink
• Extended max. ambient temperature to 125°C (85°C with conventional model)
• Built-in Pt100 sensor monitor temperature of resistive element
Easily define size of suitable heat sink
As safety function for continuous operation

APPLICATIONS
• Output reference of precision power supply
• Reference of charge-discharge test for high capacity batteries