Features
Includes ST state-of-the-art patented technology.
Module content
• All-in-one Wi-Fi/Bluetooth® LE/802.15.4 wireless microcontroller
• Embedded 40 MHz high-precision crystal
• All RF components for transmission and reception matching network, including
antenna filter
• Three variants: embedded antenna (-B version), RF connector (-U version), RF
pin output (-P version)(1)
Standard
• IEEE 802.11b/g/n/ax
• Bluetooth® LE 5.4
• IEEE 802.15.4 (Thread)(1)
Wi-Fi
• Wi-Fi 6, 2.4 GHz RF transceiver
Wi-Fi 20/40 MHz bandwidth, 1T1R
Wi-Fi security WPS(1)/WEP/WPA/WPA2/WPA3
• STA, SoftAP, concurrent STA + SoftAP
• Maximum Tx power: 21 dBm
• Tx power (HE40 and MCS9): 16 dBm
• Rx sensitivity (HE40 and MCS9): -67 dBm
• Application throughput up to 17 Mbps (TCP)
• LDPC, STBC, beamforming, DL/UL OFDMA, MU-MIMO, target wake time
(TWT)(1), spatial reuse (SR), dual carrier modulation (DCM), extended range
(ER)
• A-MPDU, A-MSDU, immediate block ACK, fragmentation, and defragmentation
Bluetooth® LE
• Maximum Tx power:
– Bluetooth® LE (2 Mbps): +10 dBm
– Bluetooth® LE (1 Mbps): +10 dBm
• Rx sensitivity
– Bluetooth® LE (2 Mbps): -96.5 dBm
– Bluetooth® LE (1 Mbps): -99 dBm
System peripherals
• SPI
• UART
Security
• PSA Level 1 certified
• Security system encryption engine
• Secure services: Secure boot and OTA (over-the-air)
Voltage
• Input voltage: 2.97 V ~ 3.63 V
• I/O voltage: 1.8 V/3.3 V
Environmental specifications
• Temperature:
– Operating: -40°C ~ +85°C
– Storage: -40°C ~ +125°C
• Humidity:
– Relative: < 90% noncondensing
– Storage: < 90% noncondensing
1. This feature is not yet available.
All packages are ECOPACK2 compliant.