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HCPL-4731 数据表 (PDF) - Broadcom Corporation.

HCPL-4731 Datasheet PDF - Broadcom Corporation.
部件名 HCPL-4731
下载  HCPL-4731 下载
文件大小   909.54 Kbytes
  19 Pages
制造商  BOARDCOM [Broadcom Corporation.]
网页  http://www.broadcom.com
标志 BOARDCOM - Broadcom Corporation.
功能描述 Very Low Power Consumption High-Gain Optocouplers

HCPL-4731 Datasheet (PDF)

Go To PDF Page 下载 数据表
HCPL-4731 Datasheet PDF - Broadcom Corporation.

部件名 HCPL-4731
下载  HCPL-4731 Click to download

文件大小   909.54 Kbytes
  19 Pages
制造商  BOARDCOM [Broadcom Corporation.]
网页  http://www.broadcom.com
标志 BOARDCOM - Broadcom Corporation.
功能描述 Very Low Power Consumption High-Gain Optocouplers

HCPL-4731 数据表 (HTML) - Broadcom Corporation.


HCPL-4731 产品详情

Description
These Broadcom® devices are very low power consumption, high-gain, single- and dual-channel optocouplers. The HCPL-4701 represents the single-channel, 8-pin DIP configuration and is pin compatible with the industry-standard 6N139. The HCPL-4731 represents the dual-channel 8-pin DIP configuration and is pin compatible with the popular standard HCPL-2731. The HCPL-070A and HCPL-073A are the equivalent single- and dual-channel products in an SO-8 footprint. Each channel can be driven with an input current as low as 40 μA and has a typical current transfer ratio of 3500%.
These high-gain couplers use an AlGaAs LED and an integrated high-gain photodetector to provide an extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage results in TTL compatible saturation voltages and high-speed operation. Where desired, the VCC and VO terminals can be tied together to achieve conventional Darlington operation (single-channel package only).
These devices are designed for use in CMOS, LSTTL, or other low power applications. They are especially well suited for ISDN telephone interface and battery-operated applications due to the low power consumption. A 700% minimum current transfer ratio is guaranteed from 0°C to 70°C operating temperature range at 40 μA of LED current and VCC ≥ 3V.
The SO-8 does not require through holes in a PCB. This package occupies approximately one-third the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface-mount processes.

Features
 Ultra low input current capability: 40 μA
 Specified for 3V operation
– Typical power consumption: <1 mW
– Input power: <50 μW
– Output power: <500 μW
 Will operate with VCC as low as 1.6V
 High current transfer ratio: 3500% at IF = 40 μA
 TTL and CMOS compatible output
 Specified ac and dc performance over temperature:
0°C to 70°C
 Safety approval
– UL recognized: 3750 Vrms for 1 minute and 5000 Vrms
for 1 minute per UL1577
– CSA approved
– IEC/EN/DIN EN 60747-5-5 approved with
VIORM = 630V peak
(Option 060) for HCPL-4701
 8-pin product compatible with 6N138/6N139 and
HCPL-2730/HCPL-2731
 Available in 8-pin DIP and SOIC-8 footprint
 Through-hole and surface-mount assembly available
Applications
 Battery-operated applications
 ISDN telephone interface
 Ground isolation between logic families – TTL, LSTTL,
CMOS, HCMOS, HL-CMOS, LV-HCMOS
 Low input current line receiver
 EIA RS-232C line receiver
 Telephone ring detector
 AC line voltage status indicator – low input power
dissipation
 Low power systems – ground isolation
 Portable system I/O interface




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关于 Broadcom Corporation.


Broadcom Corporation was an American semiconductor company that designed and manufactured a wide range of products for wired and wireless communication, storage, and industrial markets. The company was founded in 1991 and was based in Irvine, California.

Broadcom Corporation's products were used in a variety of applications, including data centers, smartphones, home networking, broadband, and automotive industries. The company's portfolio included chips for Wi-Fi, Bluetooth, Ethernet, and other connectivity technologies, as well as processors for storage devices, switches, and routers.

In 2016, Broadcom Corporation announced its intention to acquire Brocade Communications Systems, a networking company that provided data center solutions, for $5.9 billion. The acquisition was completed in November 2017.

In 2018, Broadcom Corporation relocated its headquarters to San Jose, California, and changed its name to Broadcom Inc. Today, Broadcom Inc. is a global technology company that provides a wide range of semiconductor and infrastructure software solutions for wired and wireless communications, enterprise storage, and industrial markets.

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。




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