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SN74LVC1G3208DBVT 数据表 (PDF) - Texas Instruments

SN74LVC1G3208DBVT Datasheet PDF - Texas Instruments
部件名 SN74LVC1G3208DBVT
下载  SN74LVC1G3208DBVT 下载
文件大小   717.13 Kbytes
页   23 Pages
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments
功能描述 Single 3-Input Positive OR-AND Gate

SN74LVC1G3208DBVT Datasheet (PDF)

Go To PDF Page 下载 数据表
SN74LVC1G3208DBVT Datasheet PDF - Texas Instruments

部件名 SN74LVC1G3208DBVT
下载  SN74LVC1G3208DBVT Click to download

文件大小   717.13 Kbytes
页   23 Pages
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments
功能描述 Single 3-Input Positive OR-AND Gate

SN74LVC1G3208DBVT 数据表 (HTML) - Texas Instruments


SN74LVC1G3208DBVT 产品详情

1FEATURES
2• Available in the Texas Instruments NanoStar™
and NanoFree™ Packages
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Provides Down Translation to VCC • Max t pd of 5 ns at 3.3 V
• Low Power Consumption, 10-μA Max ICC
• ±24-mA Output Drive at 3.3 V
• Input Hysteresis Allows Slow Input Transition
and Better Switching Noise Immunity at the
Input (Vhys = 250 mV Typ @ 3.3 V)
• Can Be Used in Three Combinations:
– OR-AND Gate
– OR Gate
– AND Gate
• Ioff Supports Live Insertion, Partial-Power-
Down Mode, and Back-Drive Protection
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)

DESCRIPTION
This device is designed for 1.65-V to 5.5-V VCC
operation.
The SN74LVC1G3208 device is a single 3-input
positive OR-AND gate. It performs the Boolean function Y = (A + B) ● C in positive logic.
By tying one input to GND or VCC, the
SN74LVC1G3208 device offers two more functions.
When C is tied to VCC, this device performs as a 2-
input OR gate (Y = A + B). When A is tied to GND,
the device works as a 2-input AND gate (Y = B ● C).
This device also works as a 2-input AND gate when B is tied to GND (Y = A ● C).
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts,
using the die as the package.
This device is fully specified for partial-power-down
applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow
through the device when it is powered down.





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