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SN74LVC1GX04DBVR 数据表 (PDF) - Texas Instruments

SN74LVC1GX04DBVR Datasheet PDF - Texas Instruments
部件名 SN74LVC1GX04DBVR
下载  SN74LVC1GX04DBVR 下载
文件大小   855.96 Kbytes
  30 Pages
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments
功能描述 SN74LVC1GX04 Crystal Oscillator Driver

SN74LVC1GX04DBVR Datasheet (PDF)

Go To PDF Page 下载 数据表
SN74LVC1GX04DBVR Datasheet PDF - Texas Instruments

部件名 SN74LVC1GX04DBVR
下载  SN74LVC1GX04DBVR Click to download

文件大小   855.96 Kbytes
  30 Pages
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments
功能描述 SN74LVC1GX04 Crystal Oscillator Driver

SN74LVC1GX04DBVR 数据表 (HTML) - Texas Instruments


SN74LVC1GX04DBVR 产品详情

1 Features
1• Available in Texas Instruments NanoStar™ and
NanoFree™ Packages
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• One Unbuffered Inverter (SN74LVC1GU04) and
One Buffered Inverter (SN74LVC1G04)
• Suitable for Commonly Used Clock Frequencies:
– 15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz,
25 MHz, 26 MHz, 27 MHz, 28 MHz
• Maximum tpd of 2.4 ns at 3.3 V
• Low Power Consumption, 10-μA Maximum ICC
• ±24-mA Output Drive at 3.3 V
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human Body Model (A114-A)
– 1000-V Charged-Device Model (C101)

2 Applications
• Crystal Oscillators
• Clock Generation

3 Description
The SN74LVC1GX04 device is designed for 1.65-V to
5.5-V VCC operation. This device incorporates the
SN74LVC1GU04 (inverter with unbuffered output)
and the SN74LVC1G04 (inverter) functions into a
single device. The LVC1GX04 is optimized for use in
crystal oscillator applications.
X1 and X2 can be connected to a crystal or resonator
in oscillator applications. The device provides an
additional buffered inverter (Y) for signal conditioning
(see Figure 5). The additional buffered inverter improves the signal quality of the crystal oscillator
output by making it rail to rail.
NanoStar and NanoFree package technology is a
major breakthrough in IC packaging concepts, using
the die as the package.
This device is fully specified for partial-power-down
applications using Ioff (Y output only). The Ioff circuitry
disables the outputs, preventing damaging current
backflow through the device when it is powered down.




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