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TLV2221CDBVR 数据表 (PDF) - Texas Instruments

TLV2221CDBVR Datasheet PDF - Texas Instruments
部件名 TLV2221CDBVR
下载  TLV2221CDBVR 下载
文件大小   837.51 Kbytes
  34 Pages
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments
功能描述 Advanced LinCMOS™ RAIL-TO-RAIL VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS

TLV2221CDBVR Datasheet (PDF)

Go To PDF Page 下载 数据表
TLV2221CDBVR Datasheet PDF - Texas Instruments

部件名 TLV2221CDBVR
下载  TLV2221CDBVR Click to download

文件大小   837.51 Kbytes
  34 Pages
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments
功能描述 Advanced LinCMOS™ RAIL-TO-RAIL VERY LOW-POWER SINGLE OPERATIONAL AMPLIFIERS

TLV2221CDBVR 数据表 (HTML) - Texas Instruments


TLV2221CDBVR 产品详情

Output Swing Includes Both Supply Rails
Low Noise . . . 19 nV/√Hz Typ at f = 1 kHz
Low Input Bias Current . . . 1 pA Typ
Fully Specified for Single-Supply 3-V and
5-V Operation
Very Low Power . . . 110 μA Typ
Common-Mode Input Voltage Range
Includes Negative Rail
Wide Supply Voltage Range
2.7 V to 10 V
Macromodel Included

description
The TLV2221 is a single low-voltage operational amplifier available in the SOT-23 package. It offers a
compromise between the ac performance and output drive of the TLV2231 and the micropower TLV2211.
It consumes only 150 μA (max) of supply current and is ideal for battery-powered applications. The device
exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The
TLV2221 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2221, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for
high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great
choice when interfacing with analog-to-digital converters (ADCs).
With a total area of 5.6mm2, the SOT-23 package only requires one third the board space of the standard 8-pin
SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal
source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that
is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage
paths. The OUT and IN− terminals are on the same end of the board to provide negative feedback. Finally, gain
setting resistors and decoupling capacitor are easily placed around the package.




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