| 制造商 | 部件名 | 数据表 | 功能描述 |
 Texas Instruments |
SN65HVD10DG4
|
559Kb / 28P |
Chassis-to-Chassis Interconnects
|
 CTS Corporation |
753
|
189Kb / 4P |
High Density Packaging
|
 Vicor Corporation |
BCM48BX060Y240A00
|
790Kb / 20P |
High power density
|
|
BCM352X110Y300B00
|
854Kb / 21P |
High power density
|
|
MIL-COTS
|
1Mb / 10P |
High density
|
 List of Unclassifed Man... |
FK22PL
|
78Kb / 2P |
High Density Connectors High Density Steckverbinder
|
 TE Connectivity Ltd |
1-1773719-1
|
663Kb / 5P |
Inverted Thru Board Interconnects
|
|
5-1773463-0
|
3Mb / 10P |
QSFP28/56 and zQSFP Interconnects
|
 Amphenol Corporation |
HD38999
|
1Mb / 12P |
HIGH DENSITY INTERCONNECTS
|
 Samtec, Inc |
2854182
|
575Kb / 2P |
(2.00 mm) .0787" PITCH • HIGH-RELIABILITY CABLE INTERCONNECTS
|