| 制造商 | 部件名 | 数据表 | 功能描述 |
 Samsung semiconductor |
KBY00U00VA-B450
|
1Mb / 92P |
MCP Specification
|
 Tyco Electronics |
2-1418883-1
|
1,011Kb / 1P |
AMP MCP 1.5K / AMP MCP 2.8 REC. HOUSING, 62POS., SEALED
|
|
2-1534127-1
|
1Mb / 1P |
AMP MCP 2.8 SOCKET HSG., 21POS., SEALED WITH SECONDARY LOCKING DEVICE
|
|
3-1418883-1
|
1Mb / 1P |
AMP MCP 1.5K
|
|
8-968975-1
|
508Kb / 1P |
product group drawuing for amp mcp 2.8 hsg 6-21pos with secondary locking device
|
 Nanya Technology Corpor... |
NM1281KSLAXAJ
|
5Mb / 118P |
MCP Specification
|
|
NM1482KSLAXCL
|
5Mb / 119P |
MCP Specification
|
|
NM4484NSPAXAE
|
12Mb / 381P |
MCP Specification
|
 TE Connectivity Ltd |
114-18388
|
748Kb / 11P |
AMP MCP 6.3/4.8K CONTACT SYSTEM AMP MCP 6.3/4.8K Kontaktsystem
|
|
2382278
|
446Kb / 1P |
2POS,AMP MCP 1.5K,REC HSG ASSY,SLD 2pos. AMP MCP 1.5k Buchsengeh. Assy,ged. HDSCS
Rev. A1 |