1.1 Features 1
• TI's Single-Chip Bluetooth Solution With Bluetooth
Basic Rate (BR), Enhanced Data Rate (EDR), and
Low Energy (LE) Support; Available in Two
Variants:
– Dual-Mode Bluetooth CC2564 Controller
– Bluetooth CC2560 Controller
• CC2564 Bluetooth 4.1 Controller Subsystem
Qualified (QDID 58852); Compliant up to the HCI
Layer
• Highly Optimized for Low-Cost Designs:
– Single-Ended 50-Ω RF Interface
– Package Footprint: 76 Terminals, 0.6-mm Pitch,
8-mm x 8-mm mrQFN
• BR/EDR Features Include:
– Up to 7 Active Devices
– Scatternet: Up to 3 Piconets Simultaneously, 1
as Master and 2 as Slaves
– Up to 2 SCO Links on the Same Piconet
– Support for All Voice Air-Coding – Continuously
Variable Slope Delta (CVSD), A-Law, μ-Law,
and Transparent (Uncoded)
– CC2560B/CC2564B Devices Provide an
Assisted Mode for HFP 1.6 Wideband Speech
(WBS) Profile or A2DP Profile to Reduce Host
Processing and Power
– Support of Multiple Bluetooth Profiles With
Enhanced QoS
• LE Features Include:
– Support of Up to 10 (CC2564B) Connections
– Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption
– Independent Buffering for LE Allows Large
Numbers of Multiple Connections Without
Affecting BR/EDR Performance.
– Built-In Coexistence and Prioritization Handling
for BR/EDR and LE
• Best-in-Class Bluetooth (RF) Performance
(TX Power, RX Sensitivity, Blocking)
– Class 1 TX Power Up to +10 dBm
– –95 dbm Typical RX Sensitivity
– Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required
– Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time
– Provides Longer Range, Including 2x Range
Over Other LE-Only Solutions
• Advanced Power Management for Extended
Battery Life and Ease of Design
– On-Chip Power Management, Including Direct
Connection to Battery
– Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize Power
Consumption
• Physical Interfaces:
– UART Interface With Support for Maximum
Bluetooth Data Rates
• UART Transport Layer (H4) With Maximum
Rate of 4 Mbps
• Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps (CC2560B and
CC2564B Only)
– Fully Programmable Digital PCM-I2S Codec
Interface
• Flexibility for Easy Stack Integration and Validation
Into Various Microcontrollers, Such as MSP430™
and ARM® Cortex®-M3 and Cortex®-M4 MCUs
• CC256x Bluetooth Hardware Evaluation Tool: PCBased
Application to Evaluate RF Performance of
the Device and Configure Service Pack
• Device Pin-to-Pin Compatible With Previous
Devices or Modules

1.2 Applications
• Mobile Accessories
• Sports and Fitness Applications
• Wireless Audio Solutions
• Remote Controls
• Toys
• Test and Measurement
• Industrial: Cable Replacement
• Wireless Sensors
• Automotive Aftermarket
• Point of Service (POS)
• Wellness and Health

1.3 Description
The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and
enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device
provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller
unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to
other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software
algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of
operation.
The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI's MSP430 and
ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI's third party. iPod®
(MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode
Bluetooth Stack. Some of the profiles supported include the following:
• Serial port profile (SPP)
• Advanced audio distribution profile (A2DP)
• Audio/video remote control profile (AVRCP)
• Handsfree profile (HFP)
• Human interface device (HID)
• Generic attribute profile (GATT)
• Several Bluetooth LE profiles and services
In addition to software, this solution consists of multiple reference designs with a low BOM cost, including
a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end,
low-power audio solutions.