Product Description
Soder-Wick No Clean is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static
lectricity.
§ Requires little or no post solder cleaning
§ No corrosive residues
§ Halide free
§ ESD Safe bobbins meet specs:
MIL-STD-1686C
MIL-HDBK-263B
Static decay provision of MIL-B-81705C
§ Minimal risk of heat and static component damage

Typical Applications
Soder-Wick No Clean safely removes solder from:
§ Lugs and Posts
§ Micro Circuits
§ Surface Mount Device Pads
§ Ball Grid Array Pads