FEATURES
[ CI-MCP ]
● Operation Temperature
- (-25)oC ~ 85oC
● Package
- 221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch
- Lead & Halogen Free
[ e-NAND ]
• eMMC5.0 compatible
(Backward compatible to eMMC4.5)
• Bus mode
- Data bus width : 1 bit(default), 4 bits, 8 bits
- Data transfer rate: up to 400MB/s (HS400)
- MMC I/F Clock frequency : 0~200MHz
- MMC I/F Boot frequency : 0~52MHz
• Operating voltage range
- Vcc (NAND) : 2.7 - 3.6V
- Vccq (Controller) : 1.7 - 1.95V / 2.7 - 3.6V
• Temperature
- Operation (-25℃ ~ +85℃)
- Storage without operation (-40℃ ~ +85℃)
• Others
- This product is compliance with the RoHS
directive
• Supported features
- HS400, HS200
- HPI, BKOPS
- Packed CMD, Cache
- Partitioning, RPMB
- Discard, Trim, Erase, Sanitize
- Write protect, Lock / Unlock
- PON, Sleep / Awake
- Reliable write
- Boot feature, Boot partition
- HW / SW Reset
- Field firmware update
- Configurable driver strength
- Health(Smart) report
- Production state awareness
- Secure removal type
[ LPDDR3 ]
 VDD1 = 1.8V (1.7V to 1.95V)
 VDD2, VDDCA and VDDQ = 1.2V (1.14V to 1.30)
 HSUL_12 interface (High Speed Unterminated Logic 1.2V)
 Double data rate architecture for command, address and
data Bus;
- all control and address except CS_n, CKE latched at both
rising and falling edge of the clock
- CS_n, CKE latched at rising edge of the clock
- two data accesses per clock cycle
 Differential clock inputs (CK_t, CK_c)
 Bi-directional differential data strobe (DQS_t, DQS_c)
- Source synchronous data transaction aligned to bi-directional differential data strobe (DQS_t, DQS_c)
- Data outputs aligned to the edge of the data strobe
(DQS_t, DQS_c) when READ operation
- Data inputs aligned to the center of the data strobe
(DQS_t, DQS_c) when WRITE operation
 DM masks write data at the both rising and falling edge of
the data strobe
 Programmable RL (Read Latency) and WL (Write Latency)
 Programmable burst length: 8
 Auto refresh and self refresh supported
 All bank auto refresh and per bank auto refresh supported
 Auto TCSR (Temperature Compensated Self Refresh)
 PASR (Partial Array Self Refresh) by Bank Mask and Segment
Mask
 DS (Drive Strength)
 DPD (Deep Power Down)
 ZQ (Calibration)
 ODT (On Die Termination)