FEATURES
• High temperature thermoplastic material
• Variable spacing height for stacking headers
• Allow dual entry; mating from top or bottom
• Blank 0.64mm square contacts presents 4 surfaces of
equal quality
• Standoff design
• Duplex plating
• Tin-lead plating in press-fit area
• Retention legs option
• Press-fit designed to fit 1.02mm diameter hole, solder-toboard
product
• Meets DIN 41651 specification, HE13 and BT D2632

BENEFITS
• Reflow compatible
• Cater to a wide range of applications
• Suitable for mezzanine application and gives more flexibility in
meeting different stack height requirements
• Can be used for wire wrapping
• Allows cleaning to remove soldering contamination
• Cost-efficient
• Easy pin insertion onto PCB
• High retention force onto PCB
• Same layout on THT and press-fit
• Qualified product