Designed for 32.5 x 32.5 mm BGA components
Requires minimal space around the component’s
perimeter; ideal for densely populated PCBs
Allows the heat sink to be detached and reattached
without damaging the component or the PCB, an important
feature in the event a PCB may need to be reworked
Strong, uniform attachment force helps achieve maximum
performance from phase-changing TIMs
Eliminates the need to drill mounting holes in the PCB
Assembly comes standard with a high performance
maxiFLOW™ heat sink which maximizes convection (air)
cooling
Comes standard with clean break, reworkable, Chomerics
T-766 phase change material