Available in two types - 0.8mm height without stem or 1.5mm height with stem.

Soldering Conditions
Condition for Reflow
Available for Surface Mount Type.

1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2φCA（K）or CC（T）at solder joints（copper foil surface）. A heat resistive tape should be used to fix thermocouple.
3. Temperature profile