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UPS5817E3 数据表 (PDF) - Microsemi Corporation

UPS5817E3 Datasheet PDF - Microsemi Corporation
部件名 UPS5817E3
下载  UPS5817E3 下载
文件大小   315.5 Kbytes
  4 Pages
制造商  MICROSEMI [Microsemi Corporation]
网页  http://www.microsemi.com
标志 MICROSEMI - Microsemi Corporation
功能描述 POWERMITE 1??SURFACE MOUNT 1 AMP 20 and 40 V SCHOTTKY RECTIFIERS

UPS5817E3 Datasheet (PDF)

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UPS5817E3 Datasheet PDF - Microsemi Corporation

部件名 UPS5817E3
下载  UPS5817E3 Click to download

文件大小   315.5 Kbytes
  4 Pages
制造商  MICROSEMI [Microsemi Corporation]
网页  http://www.microsemi.com
标志 MICROSEMI - Microsemi Corporation
功能描述 POWERMITE 1??SURFACE MOUNT 1 AMP 20 and 40 V SCHOTTKY RECTIFIERS

UPS5817E3 数据表 (HTML) - Microsemi Corporation


UPS5817E3 产品详情

DESCRIPTION
The UPS5817e3 and UPS5819e3 offer a small and powerful surface mount package that is RoHS compliant for a 1 Amp rated Schottky. These ratings are found only in much larger packages. They are ideal for surface mount applications that operate at high frequencies with their “hot carrier” features that provide extremely fast switching. The very low thermal resistance of the patented Powermite 1™ package design with a full metallic bottom and unique locking tab act as an efficient heat path to a heat sink mounting permitting cooler operating junction temperatures for minimal reverse leakage currents and lower power loss. It is also ideal for automatic insertion equipment.

FEATURES
• Low profile DO-216 package (<1.1 mm)
• RoHS compliant with e3 suffix part number
• Small footprint area of 8.45 mm2
• Plastic package has Underwriters Laboratory
   Flammability classification 94V-0
• Unique locking tab on bottom acts as integral efficient
   heat path to heat sink (mounting substrate)
• Metal to silicon rectifier, majority carrier conduction

APPLICATIONS / BENEFITS
• High current capability with low forward voltage
• Guard-ring-die construction for transient protection
• Silicon Schottky (hot carrier) rectifier for minimal trr
   and minimal reverse recovery voltage
• Elimination of reverse-recovery oscillations to
   reduce need for EMI filtering
• For use in high-frequency switching power supplies,
   inverters, free wheeling, charge pump circuits and
   polarity protection applications
• Lower forward power loss and high efficiency
• Low inductive parasitics (<2nH) for minimal Ldi/dt
   effects
• Robust package configuration for pick-and-place
   handling
• Full-metallic bottom eliminates flux entrapment
• Small foot print with 0.100 x 0.160 inches (see
   mounting pad details on last page)




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关于 Microsemi Corporation


Microsemi Corporation是一家美国公司,专门从事半导体和系统解决方案的设计和制造。
该公司成立于1960年,总部位于加利福尼亚州的Aliso Viejo。
Microsemi提供了广泛的产品,包括模拟和混合信号集成电路,现场可编程栅极阵列(FPGA),电源管理和控制产品以及其他半导体溶液。
该公司的产品用于国防和安全,航空和航空,工业和通信等各种应用。
Microsemi以其半导体技术方面的专业知识以及向客户提供高质量可靠产品的能力。
2018年,Microsemi由Microchip Technology收购,Microchip Technology是微控制器,混合信号,模拟和安全产品的领先提供商。
Microsemi品牌不再使用,但其技术和产品仍然是Microchip投资组合的一部分。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。




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