| 制造商 | 部件名 | 数据表 | 功能描述 |
Motorola, Inc |
AN1580
|
126Kb / 4P |
MOUNTING AND SOLDERING RECOMMENDATIONS FOR THE MOTOROLA POWER FLAT PACK PACKAGE
|
Analog Devices |
AN-0971
|
439Kb / 20P |
Recommendations for Control of Radiated Emissions with isoPower Devices
REV. B |
|
AN-1109
|
645Kb / 20P |
Recommendations for Control of Radiated Emissions with iCoupler Devices
REV. 0 |
STMicroelectronics |
TN1200
|
286Kb / 16P |
package description and recommendations for use
10-Dec-2014 |
|
AN2639
|
522Kb / 15P |
Soldering recommendations and package information for Lead-free ECOPACK microcontrollers
07-Jul-2014 |
OptoDiode Corp |
AXUV16ELCS
|
237Kb / 1P |
Ceramic socket for devices to eliminate soldering to leads
|
|
AXUV20ACS
|
230Kb / 1P |
Ceramic socket for devices to eliminate soldering to leads
|
|
AXUV20ELCS
|
220Kb / 1P |
Ceramic socket for devices to eliminate soldering to leads
|
Infineon Technologies A... |
DPS310
|
762Kb / 41P |
Digital Barometric Pressure Sensor for Portable Devices
V1.0 2016-09-05 |
|
DPS422
|
890Kb / 46P |
Digital barometric pressure & temp sensor for portable and IOT devices
V1.3 2018-08-02 |
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