| 制造商 | 部件名 | 数据表 | 功能描述 |
 Molex Electronics Ltd. |
0713086456
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 56 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
|
|
0713086414
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 14 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
|
|
0713086452
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 52 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
|
|
0713086444
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 44 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
|
|
0713086434
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 34 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
|
|
0713086422
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 22 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
|
|
0713086436
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 36 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
|
|
0713086440
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 40 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130
|
|
0713086468
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 68 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
|
|
0713086450
|
1Mb / 8P |
2.54mm (.100") Pitch C-Grid짰 Header, Surface Mount, Dual Row, Vertical, 50 Circuits1.50關m (59關") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130")
|