0877970010 数据表(PDF) - Molex Electronics Ltd.

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0877970010 数据表 (PDF) - Molex Electronics Ltd.

0877970010 Datasheet PDF - Molex Electronics Ltd.


部件名	0877970010

下载	0877970010 下载

文件大小	125.32 Kbytes

页	3 Pages

制造商	MOLEX10 [Molex Electronics Ltd.]

网页	http://www.molex.com

标志

功能描述	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging

0877970010 Datasheet (PDF)

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0877970010 Datasheet PDF - Molex Electronics Ltd.


部件名	0877970010

下载	0877970010 Click to download

文件大小	125.32 Kbytes

页	3 Pages

制造商	MOLEX10 [Molex Electronics Ltd.]

网页	http://www.molex.com

标志

功能描述	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging

0877970010 数据表 (HTML) - Molex Electronics Ltd.

0877970010 Datasheet HTML 1Page - Molex Electronics Ltd.

0877970010 Datasheet HTML 2Page - Molex Electronics Ltd.

0877970010 Datasheet HTML 3Page - Molex Electronics Ltd.

类似零件编号 - 0877970010

制造商	部件名	数据表	功能描述
Molex Electronics Ltd.	0877970040	196Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54關m (100關) Tin (Sn) Plating, 14.22mm (.560) Stacking Height

类似说明 - 0877970010

制造商	部件名	数据表	功能描述
Molex Electronics Ltd.	0879143416	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879140807	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging
	0877971800	259Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging
	0879140806	770Kb / 11P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54關m (100關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879141616	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879143216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879142216	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879141416	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879142616	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
	0879140816	3Mb / 48P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50關m (98.4關) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

关于 Molex Electronics Ltd.

Molex Electronics Ltd.是Koch Industries，Inc。的子公司，是电子和光纤互连解决方案的全球制造商。

该公司成立于1938年，总部位于伊利诺伊州的Lisle。

Molex提供各种互连产品，包括连接器，电缆组件，开关和其他被动组件。

这些产品用于各种行业，包括汽车，数据通信，消费电子，工业设备，医疗设备和电信。

Molex拥有40多个国家 /地区的运营和设施，以其在互连解决方案市场中的创新和技术领导而闻名。

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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