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LPC1850 数据表 (PDF) - NXP Semiconductors

LPC1850 Datasheet PDF - NXP Semiconductors
部件名 LPC1850
下载  LPC1850 下载
文件大小   550.92 Kbytes
  84 Pages
制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors
功能描述 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD

LPC1850 Datasheet (PDF)

Go To PDF Page 下载 数据表
LPC1850 Datasheet PDF - NXP Semiconductors

部件名 LPC1850
下载  LPC1850 Click to download

文件大小   550.92 Kbytes
  84 Pages
制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors
功能描述 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD

LPC1850 数据表 (HTML) - NXP Semiconductors


LPC1850 产品详情

General description
The LPC1850/30/20/10 are ARM Cortex-M3 based microcontrollers for embedded applications. The ARM Cortex-M3 is a next generation core that offers system enhancements such as low power consumption, enhanced debug features, and a high level of support block integration.
The LPC1850/30/20/10 operate at CPU frequencies of up to 180 MHz. The ARM Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with separate local instruction and data buses as well as a third bus for peripherals. The ARM Cortex-M3 CPU also includes an internal prefetch unit that supports speculative branching.
The LPC1850/30/20/10 include up to 200 kB of on-chip SRAM, a quad SPI Flash Interface (SPIFI), a State Configurable Timer (SCT) subsystem, two High-speed USB controllers, Ethernet, LCD, an external memory controller, and multiple digital and analog peripherals.

Features and benefits
■ Processor core
   ◆ ARM Cortex-M3 processor, running at frequencies of up to 180 MHz.
   ◆ ARM Cortex-M3 built-in Memory Protection Unit (MPU) supporting eight regions.
   ◆ ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
   ◆ Non-maskable Interrupt (NMI) input.
   ◆ JTAG and Serial Wire Debug, serial trace, eight breakpoints, and four watch points.
   ◆ Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.
   ◆ System tick timer.
■ On-chip memory
   ◆ 200 kB SRAM for code and data use.
   ◆ Multiple SRAM blocks with separate bus access.
   ◆ 64 kB ROM containing boot code and on-chip software drivers.
   ◆ 32-bit One-Time Programmable (OTP) memory for general-purpose use.
■ Clock generation unit
   ◆ Crystal oscillator with an operating range of 1 MHz to 25 MHz.
   ◆ 12 MHz internal RC oscillator trimmed to 1 % accuracy over temperature and
      voltage.
   ◆ Ultra-low power RTC crystal oscillator.
   ◆ Three PLLs allow CPU operation up to the maximum CPU rate without the need for
      a high-frequency crystal. The second PLL is dedicated to the High-speed USB, the
      third PLL can be used as audio PLL.
   ◆ Clock output.
■ Configurable digital peripherals:
   ◆ State Configurable Timer (SCT) subsystem on AHB.
   ◆ Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs and
      outputs to event driven peripherals like timers, SCT, and ADC0/1.
■ Serial interfaces:
   ◆ Quad SPI Flash Interface (SPIFI) with 1-, 2-, or 4-bit data at rates of up to
      52 MB per second.
   ◆ 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high
      throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time
      stamping (IEEE 1588-2008 v2).
   ◆ One High-speed USB 2.0 Host/Device/OTG interface with DMA support and
      on-chip high-speed PHY (USB0).
   ◆ One High-speed USB 2.0 Host/Device interface with DMA support, on-chip
      full-speed PHY and ULPI interface to an external high-speed PHY (USB1).
   ◆ USB interface electrical test software included in ROM USB stack.
   ◆ Four 550 UARTs with DMA support: one UART with full modem interface; one
      UART with IrDA interface; three USARTs support UART synchronous mode and a
      smart card interface conforming to ISO7816 specification.
   ◆ Up to two C_CAN 2.0B controllers with one channel each. Use of C_CAN controller
      excludes operation of all other peripherals connected to the same bus bridge See
      Figure 1 and Ref. 1.
   ◆ Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA
      support.
   ◆ One Fast-mode Plus I2C-bus interface with monitor mode and with open-drain I/O
      pins conforming to the full I2C-bus specification. Supports data rates of up to
      1 Mbit/s.
   ◆ One standard I2C-bus interface with monitor mode and standard I/O pins.
   ◆ Two I2S interfaces with DMA support, each with one input and one output. (Continue ...)




类似零件编号 - LPC1850

制造商部件名数据表功能描述
logo
NXP Semiconductors
LPC1850 NXP-LPC1850 Datasheet
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类似说明 - LPC1850

制造商部件名数据表功能描述
logo
NXP Semiconductors
LPC1850_1109 NXP-LPC1850_1109 Datasheet
1Mb / 142P
32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller
Rev. 2.2-9 September 2011
LPC1850_1112 PHILIPS-LPC1850_1112 Datasheet
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32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller
Rev. 3-6 December 2011
LPC1311 NXP-LPC1311_12 Datasheet
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Rev. 5-6 June 2012
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Rev. 6.1-7 February 2013
LPC18S5X PHILIPS-LPC18S5X_15 Datasheet
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32-bit ARM Cortex-M3 MCU; up to 1 MB flash and 136 kB SRAM; Ethernet, two High-speed USB, LCD, EMC, AES engine
Rev. 1-24 February 2015
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32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 154 kB SRAM; Ethernet, two High-speed USB, LCD, EMC
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LPC185X NXP-LPC185X Datasheet
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关于 NXP Semiconductors


NXP半导体是一家公开交易的跨国公司,设计,开发和制造各种半导体和集成电路,用于各种应用,包括汽车,工业,通信和消费市场。

该公司成立于2006年,总部位于荷兰的埃因霍温。

NXP提供了广泛的产品组合,包括微控制器,微处理器,安全身份验证IC,电源管理ICS,RF和微波炉组件以及传感器解决方案等。

该公司的产品旨在具有节能,安全和可靠,并用于各种应用中,包括汽车系统,工业自动化和控制,智能家居和建筑物以及连接的设备。

NXP致力于创新和客户满意度,并致力于为客户提供最佳的半导体解决方案,以满足他们的需求。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。




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