DFN-2-0402 数据表(PDF)

功能描述	package outline & pad layout

类似零件编号 - DFN-2-0402

制造商	部件名	数据表	功能描述
Analog Microelectronics	DFN-10B	52Kb / 1P	(3x3x0.75mm) MIN 0.700 MAX 0.800
	DFN-10B	34Kb / 1P	(3x3x0.75mm) Carrier Width (W) 12.0-0.1 mm
	DFN-6D	33Kb / 1P	(2x2x0.75mm) MIN 0.700 MAX 0.800
	DFN-6D	27Kb / 1P	(2x2x0.75mm) Carrier Width (W) 8.0-0.1 mm
Unisonic Technologies	DFN-8	231Kb / 6P	1.1W AUDIO POWER AMPLIFIER WITH SHUTDOWN MODE

制造商	部件名	数据表	功能描述
Maxim Integrated Produc...	21-0109B	35Kb / 1P	PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD Rev B
Diodes Incorporated	AP02001	174Kb / 12P	SUGGESTED PAD LAYOUT AP02001 Rev. 38
	AP02001	188Kb / 14P	SUGGESTED PAD LAYOUT Rev 43
	AP02001	404Kb / 27P	SUGGESTED PAD LAYOUT Rev 52
Maxim Integrated Produc...	21-0108	71Kb / 2P	PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD Rev K
Maxim Integrated Produc...	21-0111	31Kb / 1P	PACKAGE OUTLINE, 8L SOIC,150 EXPOSED PAD Rev E
Cooper Bussmann, Inc.	CTX10-5P	117Kb / 1P	RECOMMENDED PCB PAD LAYOUT
All Sensors Corporation	CFFS	275Kb / 1P	For suggested pad layout, see drawing: PAD-01
	CPFR	290Kb / 1P	For suggested pad layout, see drawing: PAD-01
	EGNL	39Kb / 1P	For suggested pad layout, see drawing: PAD-01