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LX5553LU 数据表 (PDF) - Microsemi Corporation

LX5553LU Datasheet PDF - Microsemi Corporation
部件名 LX5553LU
下载  LX5553LU 下载
文件大小   93.3 Kbytes
  3 Pages
制造商  MICROSEMI [Microsemi Corporation]
网页  http://www.microsemi.com
标志 MICROSEMI - Microsemi Corporation
功能描述 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier, LNA & SP3T Switch

LX5553LU Datasheet (PDF)

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LX5553LU Datasheet PDF - Microsemi Corporation

部件名 LX5553LU
下载  LX5553LU Click to download

文件大小   93.3 Kbytes
  3 Pages
制造商  MICROSEMI [Microsemi Corporation]
网页  http://www.microsemi.com
标志 MICROSEMI - Microsemi Corporation
功能描述 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier, LNA & SP3T Switch

LX5553LU 数据表 (HTML) - Microsemi Corporation


LX5553LU 产品详情

DESCRIPTION
LX5553 is a high-integration, highperformance WLAN front-end module (FEM) for 802.11b/g/n and other applications in the 2.4-2.5GHz frequency range. LX5553 integrates an advanced InGaP/GaAs Hetero-junction Bipolar Transistor (HBT) power amplifier with on chip impedance matching, a fully matched low noise amplifier based on InGaAs Enhancement mode pseudo-morphic high electron mobility transistor (E-pHEMT) technology, and a Depletion mode pHEMT (D-pHEMT) singlepole triple-throw (SP3T) switch, all into a single package with 3x3mm footprint. LX5553 provides capability of sharing a single antenna between WLAN and Bluetooth systems through the SP3T switch.

KEY FEATURES
◾ 2.4-2.5GHz 802.11b/g/n FrontEnd Solution in a Single MLP Package
◾ SP3T for Sharing Antenna between WLAN and Bluetooth systems
◾ All RF I/O Matched to 50 
◾ Single-Supply Voltage 3.0V to 4.2V
◾ Small Footprint: 3x3mm2
◾ Low Profile: 0.55mm
◾ RoHS Compliant & Pb-Free

TX Features :
◾ Power Gain ~ 25 dB*
◾ Pout ~ +17 dBm* for 3% EVM at Antenna
◾ Current ~145 mA at +17 dBm*
◾ Pout ~ +21 dBm* for 11b 1Mbps DSSS Mask Compliance
◾ Quiescent Current ~ 82 mA

RX Features :
◾ Gain ~ 13 dB*
◾ Noise Figure ~ 2.1 dB*
◾ IIP3 ~ +5 dBm*

Bluetooth Path :
◾ Insertion Loss ~ 0.9 dB
◾ IP1dB ~ +29 dBm
* Including SP3T switch loss

APPLICATIONS
◾ IEEE 802.11b/g/n
◾ Mobile Phone WLAN module




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关于 Microsemi Corporation


Microsemi Corporation是一家美国公司,专门从事半导体和系统解决方案的设计和制造。
该公司成立于1960年,总部位于加利福尼亚州的Aliso Viejo。
Microsemi提供了广泛的产品,包括模拟和混合信号集成电路,现场可编程栅极阵列(FPGA),电源管理和控制产品以及其他半导体溶液。
该公司的产品用于国防和安全,航空和航空,工业和通信等各种应用。
Microsemi以其半导体技术方面的专业知识以及向客户提供高质量可靠产品的能力。
2018年,Microsemi由Microchip Technology收购,Microchip Technology是微控制器,混合信号,模拟和安全产品的领先提供商。
Microsemi品牌不再使用,但其技术和产品仍然是Microchip投资组合的一部分。

*此信息仅供一般参考,对于因上述信息造成的任何损失或损害,我们概不负责。




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