PRODUCT DESCRIPTION
AWC6323 addresses the demand for increased integration in dual-band handsets for CDMA networks. The small footprint 3 mm x 5 mm x 1 mm surface mount RoHS compliant package contains independent RF PA paths to ensure optimal performance in both frequency bands, while achieving a 25% PCB space savings compared with solutions requiring two single-band PAs. The package pinout was chosen to enable handset manufacturers to easily route bias to both power amplifiers and simplify control with common mode pins. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.

FEATURES
• InGaP HBT Technology
• High Efficiency (Cell Band):
    • 37.5 % @ POUT = +27.6 dBm
    • 23 % @ POUT = +16 dBm
    • 11.5 % @ POUT = +10 dBm
• Low Quiescent Current: 3.5 mA
• Internal Voltage Regulation
• Built-in Directional Coupler
• Common VMODE Control Line
• Simplified VCC Bus PCB routing
• Reduced External Component Count
• Low Profile Surface Mount Package: 1 mm
• RoHS Compliant Package, 260 oC MSL-3

APPLICATIONS
• Cell & PCS Dual-band Wireless Handsets and Data Devices for CDMA/EVDO networks.