FEATURES
✧ For surface mounted applications in order to optimize board space.
✧ Low profile package.
✧ Built-in strain relief.
✧ Glass passivated junction.
✧ Low inductance.
✧ Excellent clamping capability.
✧ Repetition Rate (duty cycle): 0.01%.
✧ Fast response time: typically less than 1.0ps from 0 volt to VBR for 8nidirectional types.
✧ Typical IR less than 1μA above 10V.
✧ High Temperature soldering: 260°C/10 seconds at terminals.
✧ Plastic package has Underwriters Laboratory Flammability 94V-O.

MECHANICAL DATA
✧ Case: JEDEC DO-201 Molded Plastic.
✧ Terminals: Axial leads, solderable per MIL-STD-750, Method 2026.
✧ Polarity: Color and dG enotes cathode except Bipolar.
✧ Standard Packaging: 12mm tape (EIA STD RS-481).
✧ Weight: 0.002 ounce, 0.061 grams.