| 制造商 | 部件名 | 数据表 | 功能描述 |
 Samsung semiconductor |
CL10A226MQ8NRNE
|
140Kb / 2P |
SPECIFICATION
|
|
CL21B105KBFNNNF
|
139Kb / 2P |
SPECIFICATION
|
|
CL21B473KCFNNNE
|
140Kb / 2P |
SPECIFICATION
|
 List of Unclassifed Man... |
ISR3SAD100
|
93Kb / 1P |
SPECIFICATION
|
 Shanghai Leiditech Elec... |
SMD4532-400
|
271Kb / 3P |
SPECIFICATION ELECTRICAL SPECIFICATION
|
 Molex Electronics Ltd. |
62201-6010
|
275Kb / 8P |
VHDM짰 and VHDM-HSD??Backplane Header Shield Extraction Tool Specification Sheet
3-15-10 |
|
62201-6100
|
312Kb / 14P |
VHDM짰 and VHDM-HSD??Backplane Header Shield Extraction Tool Specification Sheet
3-15-10 |
|
62201-6000
|
270Kb / 12P |
VHDM짰 and VHDM-HSD??Backplane Header Shield Extraction Tool Specification Sheet
3-15-10 |
 Microchip Technology |
AC162059
|
782Kb / 78P |
Debug Header Specification
2006-2012 |
 Molex Electronics Ltd. |
PK-5569-002
|
123Kb / 2P |
BULK PACKAGING SPECIFICATION FOR: 5569, 45558 & 172648 HEADER ASS’YS
2015/08/24 |