| 制造商 | 部件名 | 数据表 | 功能描述 |
 PhaseLink Corporation |
TB502
|
44Kb / 1P |
Test Board for chip evaluation and Layout recommendations
|
|
TB502-3X-520-XX
|
43Kb / 2P |
Test Board for chip evaluation and Layout recommendations
|
 STMicroelectronics |
AN1235
|
257Kb / 14P |
package description and recommendations for use
19-Oct-2012 |
|
AN2348
|
267Kb / 17P |
package description and recommendations for use
19-Oct-2012 |
|
AN4208
|
288Kb / 16P |
package description and recommendations for use
05-Aug-2013 |
|
TN1200
|
286Kb / 16P |
package description and recommendations for use
10-Dec-2014 |
|
TN0991
|
727Kb / 21P |
Description of WLCSP for STMicroelectronics EEPROMs and recommendations for use
23-Jul-2013 |
|
TN1163
|
651Kb / 21P |
Description of WLCSP for microcontrollers and recommendations for use
25-Jun-2014 |
 Silicon Laboratories |
AN583
|
347Kb / 11P |
Safety Considerations and Layout Recommendations for Digital Isolators
|
 NXP Semiconductors |
AN11689
|
1Mb / 18P |
Recommendations for PCB assembly of DSN1006
Rev. 1-29 July 2015 |