| 制造商 | 部件名 | 数据表 | 功能描述 |
 Seoul Semiconductor |
STW7C2SA
|
1Mb / 31P |
Thermally Enhanced Package Design
|
|
STW8B12B
|
871Kb / 30P |
Thermally Enhanced Package Design
|
|
STW8B12B-NZ
|
812Kb / 24P |
Thermally Enhanced Package Design
|
|
STW8B12C
|
894Kb / 31P |
Thermally Enhanced Package Design
|
|
STW8B12G
|
911Kb / 29P |
Thermally Enhanced Package Design
|
|
STW9B12G
|
718Kb / 24P |
Thermally Enhanced Package Design
|
|
STW9C2SA
|
1Mb / 32P |
Thermally Enhanced Package Design
|
|
STW7C12Y
|
886Kb / 25P |
Thermally Enhanced Package Design
|
|
STW8C2SB-NZ
|
1Mb / 30P |
Thermally Enhanced Package Design
|
|
STW9C2SB-NZ
|
1Mb / 30P |
Thermally Enhanced Package Design
|