TSON8-FL 数据表(PDF) - Amkor Technology

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TSON8-FL 数据表 (PDF) - Amkor Technology

TSON8-FL Datasheet PDF - Amkor Technology


部件名	TSON8-FL

下载	TSON8-FL 下载

文件大小	740.38 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Bare copper leadframe with no plating

TSON8-FL Datasheet (PDF)

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下载数据表

TSON8-FL Datasheet PDF - Amkor Technology


部件名	TSON8-FL

下载	TSON8-FL Click to download

文件大小	740.38 Kbytes

页	2 Pages

制造商	AMKOR [Amkor Technology]

网页	http://www.amkor.com

标志

功能描述	Bare copper leadframe with no plating

TSON8-FL 数据表 (HTML) - Amkor Technology

TSON8-FL Datasheet HTML 1Page - Amkor Technology

TSON8-FL Datasheet HTML 2Page - Amkor Technology

类似零件编号 - TSON8-FL

制造商	部件名	数据表	功能描述
Amkor Technology	TSON8-FL-V01	928Kb / 2P	TSON8-FL (Flat Lead) is a smaller package (3.3 x 3.3 mm) with thermal enhancments that give a 64% reduction in footprint area compared with standard SOIC 8 ld package 02/21

类似说明 - TSON8-FL

制造商	部件名	数据表	功能描述
Lite-On Technology Corp...	CN-111010	34Kb / 2P	Tin Lead Plating Phase Out for Leadframe Products
Amkor Technology	SOD123-FL	446Kb / 2P	Bare copper leadframe with no plating
Amkor Technology	SOD128-FL	445Kb / 2P	Bare copper leadframe with no plating
List of Unclassifed Man...	1344803	109Kb / 4P	24 AWG Solid Bare Copper Conductors, Polyolefin Insulation
	1345253	101Kb / 3P	23 AWG Solid .023 bare copper or bare copper-covered steel conductor, polyethylene insulation
	1345263	106Kb / 4P	24 AWG Solid Bare Copper Conductors, Polyolefin Insulation
	1347027	102Kb / 3P	Series 6, 18 AWG solid .040 bare copper or bare copper-covered steel conductor
Bourns Electronic Solut...	CSM2F-7036	614Kb / 4P	Shunt Resistor with Sense Pins & Bare Copper Terminals 10/22
	CSM2F-8518	620Kb / 4P	Shunt Resistor with Sense Pins & Bare Copper Terminals 10/22
	CSM2F-8536	621Kb / 4P	Shunt Resistor with Sense Pins & Bare Copper Terminals 10/22

关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。

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