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FUSIONQUAD 数据表 (PDF) - Amkor Technology
FUSIONQUAD Datasheet PDF - Amkor Technology
部件名 FUSIONQUAD
下载  FUSIONQUAD 下载
文件大小   394.04 Kbytes
页   2 Pages
制造商  AMKOR [Amkor Technology]
网页  http://www.amkor.com
标志 AMKOR - Amkor Technology
功能描述 Increased I/O (116 to 356) in smaller package footprints

FUSIONQUAD Datasheet (PDF)

Go To PDF Page 下载 数据表
FUSIONQUAD Datasheet PDF - Amkor Technology

部件名 FUSIONQUAD
下载  FUSIONQUAD Click to download

文件大小   394.04 Kbytes
页   2 Pages
制造商  AMKOR [Amkor Technology]
网页  http://www.amkor.com
标志 AMKOR - Amkor Technology
功能描述 Increased I/O (116 to 356) in smaller package footprints

FUSIONQUAD 数据表 (HTML) - Amkor Technology




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关于 Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*此信息仅供一般参考，对于因上述信息造成的任何损失或损害，我们概不负责。




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