32-bit MCUs (up to 2 MB Live-Update Flash and 512 KB SRAM) with Audio and Graphics Interfaces, HS USB, Ethernet, and Advanced Analog

Operating Conditions
• 2.2V to 3.6V, -40ºC to +85ºC, DC to 200 MHz
• 2.2V to 3.6V, -40ºC to +125ºC (Planned)

Core: 200 MHz (up to 330 DMIPS) microAptiv™
• 16 KB I-Cache, 4 KB D-Cache
• MMU for optimum embedded OS execution
• microMIPS™ mode for up to 35% smaller code size
• DSP-enhanced core:
   - Four 64-bit accumulators
   - Single-cycle MAC, saturating and fractional math
• Code-efficient (C and Assembly) architecture

Clock Management
• 0.9% internal oscillator
• Programmable PLLs and oscillator clock sources
• Fail-Safe Clock Monitor (FSCM)
• Independent Watchdog Timers (WDT) and Deadman
   Timer (DMT)
• Fast wake-up and start-up

Power Management
• Low-power modes (Sleep and Idle)
• Integrated Power-on Reset and Brown-out Reset

Memory Interfaces
• 50 MHz External Bus Interface (EBI)
• 50 MHz Serial Quad Interface (SQI)

Audio and Graphics Interfaces
• Graphics interfaces: EBI or PMP
• Audio data communication: I2S, LJ, and RJ
• Audio control interfaces: SPI and I2C™
• Audio master clock: Fractional clock frequencies with USB
   synchronization

High-Speed (HS) Communication Interfaces(with Dedicated DMA)
• USB 2.0-compliant Hi-Speed On-The-Go (OTG) controller
• 10/100 Mbps Ethernet MAC with MII and RMII interface

Security Features
• Crypto Engine with a RNG for data encryption/decryption
   and authentication (AES, 3DES, SHA, MD5, and HMAC)
• Advanced memory protection:
   - Peripheral and memory region access control

Direct Memory Access (DMA)
• Eight channels with automatic data size detection
• Programmable Cyclic Redundancy Check (CRC)

Advanced Analog Features
• 12-bit ADC module:
   - 28 Msps with six Sample and Hold (S&H) circuits
   - Up to 48 analog inputs
• Flexible and independent ADC trigger sources
• Two comparators with 32 programmable voltage references
• Temperature sensor with ±2ºC accuracy (Continue ...)